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PCB Specifications

Features Capability Notes Patterns
Layer count 1,2,4,6 layers The number of copper layers in the board.
Controlled Impedance 4/6 layer, default layer stack-up



Material FR-4 FR-4 Standard Tg 130-140/ Tg 155
Dielectric constant 4.5(double-side PCB)

7628 structure 4.6

2313 structure 4.05

2116 structure 4.25

Max. Dimension 400x500mm The maximum dimension
Dimension Tolerance ±0.2mm ±0.2mm for CNC routing, and ±0.4mm for V-scoring
Board Thickness 0.4/0.6/0.8/1.0/1.2/1.6/2.0mm The thickness of finished board.

Thickness Tolerance

( Thickness≥1.0mm)

± 10% e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)

Thickness Tolerance

( Thickness<1.0mm)

± 0.1mm e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).
Finished Outer Layer Copper 1 oz/2 oz (35um/75um) Finished copper weight of outer layer is 1oz or 2oz.
Finished Inner Layer Copper 0.5 oz (17um) Finished copper weight of inner layer is 0.5oz only.

Drill/Hole Size

Features Capability Notes Patterns
Drill Hole Size (Mechanical)0.20mm - 6.30mm Min. drill size is 0.20mm. Max drill size is 6.30mm.
Drill Hole Size Tolerance +0.13/-0.08mm

e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable.

Blind/Buried Vias Not supported Blind vias are not supported currently, only through holes
Min. Via hole size0.2mm
  1. Single & Double Layer PCB: 0.3mm
  2. Multi-Layer PCB: 0.2mm
Min. Via Diameter 0.45mm
  1. Single & Double Layer PCB: 0.6mm
  2. Multi Layer PCB: 0.45mm
PTH Hole Size 0.20mm - 6.35mm The annular ring size will be enlarged to 0.15mm in production.
Pad Size 0.70mm - 6.35 The pad hole size will be enlarged 0.15mm in production.

Min. Non-plated Holes

0.50mm

The minimum NPTH dimension is 0.50mm. Please add the NPTH in the mechanical layer or keep out layer.

Min. Plated Slots

0.65mmThe minimum plated slot width is 0.65mm, which is drawn with a pad.
Min. Non-Plated Slots1.0mm The minimum Non-Plated slot Width is 1.0mm, please draw the slot outline in the mechanical layer (GML or GKO).
Min. Castellated Holes0.60mmThe minimum diameter of castellated holes is 0.60mm.
Hole Size Tolerance (Plated)+0.13mm/-0.08mme.g for the 1.00mm Plated hole the acceptable finished hole size is between 0.92mm to 1.13mm
Hole Size Tolerance (Non-Plated)

±0.2mm

e.g for the 1.00mm Plated hole the acceptable finished hole size is between 0.80mm to 1.20mm

Rectangle Hole/SlotNot supportedWe don't make rectangle holes/slots. The rectangle holes/slots will be made round or oval by default.

Minimum Annular Ring

Minimum annular ring PTH Patterns
1oz Copper 0.13mm0.3mm
2oz Copper 0.2mm 0.3mm

Minimum Clearance

Features Capability Patterns
Hole to hole clearance (Different nets) 0.5mm
Via to Via clearance (Same nets) 0.254mm
Pad to Pad clearance (Pad without hole, Different nets) 0.127mm
Pad to Pad clearance (Pad with hole, Different nets 0.5mm
Via to Track 0.254
PTH to Track 0.33mm
NPTH to Track 0.254mm
Pad to Track 0.2mm

Minimum trace width and spacing

Copper weight Min. Trace width Min. Spacing Patterns
H/HOZ (Inner layer) 5mil (0.127mm) 5mil (0.127mm)
1oz (Outer layer) 1/2 layers: 5mil (0.127mm)
4/6 layers: 3.5mil (0.09mm)
1/2 layers: 5mil(0.127mm)
4/6 layers: 3.5mil(0.09mm)
2oz (Outer layer) 8mil (0.2mm) 8mil (0.2mm)

BGA

Layer count Min. BGA Pad Dimensions Min. Distance between BGA Patterns
1/2 layers 0.4 mm 0.127mm
4/6 layers 0.25mm 0.127mm

Solder Mask

Features Capability Notes Patterns
Solder mask opening/expansion 0.05mm The solder mask should have a minimum of a 0.05 mm "growth/mask opening" around the pad to allow for any mis-registration.
Solder bridge 0.2mm (green)
0.254mm (other colors)
To have solder mask bridge, the spacing between copper pads edge must be 0.2mm (8mils) or more.
Solder mask color green, red, yellow, blue, white and black We use LPI (Liquid Photo Imageable) solder mask. It is the most common type of mask used today.
Solder mask dielectric constant 3.8
Solder mask thickness 10-15UM

Legend

Features Capabilities Notes Patterns
Minimum Line Width 6 mil (0.153mm) Characters with width less than 6mil (0.153mm) will be unidentifiable.
Minimum Text Height 32 mil (0.8mm) Characters with height less than 32mil (0.8mm) will be unidentifiable.
Character width to height ration 1:6 The preffered ration of width to height is 1:6.
Pad To Silkscreen 0.15 mm The minimum distance between pad and silkscreen is 0.15mm.

Board Outlines

Features Capability Notes Patterns
Trace to Outline 0.2mm Ships as individual board(Rounting):Trace to Outline ≥ 0.2mm
Trace to V-cut line 0.4mm Ship as panel with V-scoring: Trace to V-cut line ≥ 0.4mm

Panelization

Features Capability Notes Patterns
Panelization without space 0mm The space between boards is 0mm.
Panelization with space 2mm Make sure the space between boards should be ≥ 2mm, otherwise it will be hard to process for rounding.
Panelized Round board ≥ 20mm x 20mm

The single round board size should be ≥ 20mm x 20mm.

Panelize with stamp holes and add tooling strips on four board edges.

Panelized castellated holes board Panelize with stamp holes and add tooling strips on four board edges

The distance between castellated hole and board corner should be larger than 4mm.

Recommended diameter of stamp hole is 0.5mm - 0.8mm.

Recommended distance between the two stamp holes is 0.2 - 0.3mm.

Min. Width of Breakaway Tab 4mm The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm.
Min. Edge Rails 4mm If choosing panel by PCBNOW, we will add 5mm edge rails on both sides by default.

Csak RS-274x formátumú gerber fájlokat tudunk elfogadni a gyártáshoz!

Különböző rajzprogramok projekt fájljait nem tudjuk feldolgozni, és nem is tudunk belőle gerber állományokat készíteni ezt mindenki saját maga kell hogy elkészítse.

Mindenki ellenőrizze le hogy a saját tervező programja képes-e ilyen fájlok generálására.

A gerber állományokat tömörített ZIP fáljként kell feltölteni.

A fájlok elkészítése előtt mindenki ellenőriztesse le a saját rajz programjával hogy a gyártási feltételeknek megfelel az elkészült terv.

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